Ja-Myeong Koo: search on Z-Library

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1

Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications

Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microsystem Technologies

Year:

2007

Language:

english

File:

PDF, 452 KB

english, 2007

2

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.76 MB

english, 2008

3

Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.57 MB

english, 2007

4

Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microsystem Technologies

Year:

2007

Language:

english

File:

PDF, 319 KB

english, 2007

5

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Jung, Kwang-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Park, Bum-Geun, Jeong, Haksan, Koo, Ja-Myeong, Lee, Byunghoon, Jung, Seung-Boo

Journal:

Applied Surface Science

Year:

2019

Language:

english

File:

PDF, 5.80 MB

english, 2019

6

Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows

Ja-Myeong Koo, Bui Quoc Vu, Yu-Na Kim, Jong-Bum Lee, Jong-Woong Kim, Dae-Up Kim, Jeong-Hoon Moon, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 378 KB

english, 2008

7

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection

Kim, Jaewon, Lee, Byunghoon, Koo, Ja-Myeong, Gan, Chee Lip

Year:

2017

Language:

english

File:

PDF, 1.73 MB

english, 2017

8

Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding

Noh, Bo-In, Koo, Ja-Myeong, Jo, Jung-Lae, Jung, Seung-Boo

Journal:

Japanese Journal of Applied Physics

Year:

2008

Language:

english

File:

PDF, 364 KB

english, 2008

9

Interfacial reactions between In–48Sn solder and electroless nickel/immersion gold substrate during reflow process

Ja-Myeong Koo, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Surface and Interface Analysis

Year:

2006

Language:

english

File:

PDF, 214 KB

english, 2006

10

Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film

Lee, Jong-Bum, Lee, Jong-Gun, Jo, Jung-Lae, Koo, Ja-Myeong, Chun, Chang-Keun, Jung, Seung-Boo

Journal:

Japanese Journal of Applied Physics

Year:

2009

Language:

english

File:

PDF, 248 KB

english, 2009

11

Characterization of Failure Behaviors in Anisotropic Conductive Interconnection

Kim, Jong-Woong, Kim, Dae-Gon, Koo, Ja-Myeong, Yoon, Jeong-Won, Choi, Sunglak, Kim, Kyung-Sik, Nam, Jae-Do, Lee, Hoo-Jeong, Joo, Jinho, Jung, Seung-Boo

Journal:

MATERIALS TRANSACTIONS

Year:

2007

Language:

english

File:

PDF, 494 KB

english, 2007

12

Friction welding of TiAl and AISI4140

Won-Bae Lee, Myoung-Gyun Kim, Ja-Myeong Koo, Kyoung-Kyun Kim, D. J. Quesnel, Young-Jig Kim, Seung-Boo Jung

Journal:

Journal of Materials Science

Year:

2004

Language:

english

File:

PDF, 305 KB

english, 2004

13

Thermal degradation of anisotropic conductive film joints under temperature fluctuation

Jong-Woong Kim, Ja-Myeong Koo, Chang-Yong Lee, Bo-In Noh, Jeong-Won Yoon, Dae-Gon Kim, Sun-Kyu Park, Seung-Boo Jung

Journal:

International Journal of Adhesion and Adhesives

Year:

2008

Language:

english

File:

PDF, 1000 KB

english, 2008

14

Reliability of nickel flip chip bumps with a tin–silver encapsulation on a copper/tin–silver substrate during the bonding process

Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Sang-Su Ha, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 964 KB

english, 2007

15

Effect of substrate metallization on mechanical properties of Sn–3.5Ag BGA solder joints with multiple reflows

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 768 KB

english, 2005

16

Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

Lee, Jong-Bum, Koo, Ja-Myeong, Hong, Soon-Min, Shin, Hyoyoung, Moon, Young-jun, Jung, Jae-Pil, Yoo, Choong-Don, Jung, Seung-Boo

Journal:

Japanese Journal of Applied Physics

Year:

2008

Language:

english

File:

PDF, 497 KB

english, 2008

17

Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)

Lee, Jong-Bum, Koo, Ja-Myeong, Kim, Jong-Woong, Noh, Bo-In, Lee, Jong-Gun, Jung, Seung-Boo

Journal:

The Journal of Adhesion

Year:

2009

Language:

english

File:

PDF, 730 KB

english, 2009

18

[IEEE 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011 - Baltimore, MD, USA (2011.06.5-2011.06.10)] 2011 IEEE MTT-S International Microwave Symposium - Electrical characterization of differential stretchable transmission line

Jeon, Jae-Wan, Kim, Seong-Kyun, Koo, Ja-Myeong, Hong, Soon-Min, Moon, Young-Jun, Jung, Seung-Boo, Kim, Byung-Sung

Year:

2011

Language:

english

File:

PDF, 1.06 MB

english, 2011

19

Effect of Zn addition on mechanical properties of brass hollow spheres

Ja-Myeong Koo, Hideki Araki, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 568 KB

english, 2008

20

Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Dae-Gon Kim, Bo-In Noh, Jong-Woong Kim, Jung-Hoon Moon, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 660 KB

english, 2008

21

Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2005

Language:

english

File:

PDF, 911 KB

english, 2005

22

Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints

Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Ja-Myeong Koo, Dong-Woon Park, Myung-Wan Ko, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 2.84 MB

english, 2008

23

Interfacial reactions and mechanical properties of In–48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows

Koo, Ja-Myeong, Yoon, Jeong-Won, Jung, Seung-Boo

Journal:

Journal of Materials Research

Year:

2008

Language:

english

File:

PDF, 1.18 MB

english, 2008

24

Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder

Jeong-Won Yoon, Sang-Won Kim, Ja-Myeong Koo, Dae-Gon Kim, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 1.29 MB

english, 2004

25

Effect of boron content in electroless Ni–B layer on plating layer properties and soldering characteristics with Sn–Ag solder

Jeong-Won Yoon, Ja-Myeong Koo, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Chang-Yong Lee, Jong-Hyun Park, Chang-Chae Shur, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 1.50 MB

english, 2008

26

Induction Brazing of γ-TiAl to Alloy Steel AISI 4140 Using Filler Metal of Eutectic Ag-Cu Alloy Coated with Ti Film

Koo, Ja-Myeong, Lee, Won-Bae, Kim, Myoung-Gyun, Kim, Dae-Up, Kim, Young-Jig, Jung, Seung-Boo

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 298 KB

english, 2005

27

Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions

Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Hoo-Jeong Lee, Seung-Boo Jung

Journal:

Scripta Materialia

Year:

2007

Language:

english

File:

PDF, 494 KB

english, 2007

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